Bios of Chairs
SIG Committee Chair: Koichi Tagawa, Sony
Internet of Things Working Group Chair: Vusthla Sunil Reddy, Apple
Payment Working Group Chair: Frank Tekampe, NXP
Frank Tekampe is the Global Alliance Manager of Secure Payments within the Business Unit of Security & Connectivity of NXP Semiconductors in Hamburg, Germany. He holds a degree in Business Administration from the VWA in Wiesbaden/Giessen, Germany. In 2008, he completed his Master of Management at the Macquarie Graduate School for Management in Sydney, Australia.
Frank has over 15 years of work experience in Sales and Marketing in the field of Identification, covering applications such as Automatic Fare Collection (AFC), Access Control, eGovernment and Secure Payments. His employment record is containing industry players such as ACG, Assa Abloy ITG, BCDS Ltd., AdvanIDe and most recently NXP.
In his current role, Frank is responsible for the global strategy and alliance management in Secure Payments with respect to NXP’s product portfolio of high security IC’s and the extended ecosystem consisting of payment brands, banks and system integrators.
Retail Working Group Chair: Matthew Bright, Thin Film Electronics
Matthew Bright is the head of technical marketing at the Thin Film Electronics NFC Innovation Center in San Jose, California. Following a vision of ‘building intelligence into everyday things’, he leads customer and partner engagement for a new generation of NFC tags and RF anti-shoplifting labels based on highly scalable printed electronics technology. Matthew holds a degree in electrical engineering from the University of Michigan and has extensive experience in semiconductor marketing for mobile applications, including Flash memory, multi-chip modules, and short-range wireless communications.
Transport Working Group Co-Chair: Joerg Schmidt, Infineon
Dr. Joerg Schmidt is responsible for business development activities in the area of Transport Ticketing in Asia and the US, Near Field Communication Technology and Standardization activities for the Business Line Secure Mobile and Transactions (SMT) at Infineon Technologies. Joerg started his career in contactless technologies in 2001 at the University of Dortmund (Germany), Department of Logistics, where he co-founded the LogIDLab® as well as the RFID Competence Centre, and headed the Department of Distribution- and Transport-Logistics. He later worked as Business Development Director at Schreiner LogiData where he was responsible for national and international RFID Projects. In 2008 Joerg joined Infineon as Business Development Manager in Neubiberg, Germany, where he initially managed Object-ID projects and then moved on to his current role in 2011. Joerg is an active member of the CIPURSE™ Mobile Working Group of the OSPT Alliance. He has contributed to diverse RFID standardization activities. Joerg holds a PhD in Business Economics.
Transport Working Group Co-Chair: Cord Bartels, BSI
Technical Committee Chair: Jürgen Böhler, STMicroelectronics
Jürgen works as Software System Architect for Telecommunication and NFC chips within the Smartcard Division of STMicroelectronics. Since 1995 he has experience in designing and implementing different Smartcard operating systems. Therefore Jürgen participates since 1998 in different standardization bodies and influenced several international specifications. In 2002 he started his work in the NFC ecosystems. Since 2007 he follows up the technical groups of the NFC Forum.
Reference Applications Framework Working Group Chair: Daniel Orsatti, STMicroelectronics
Security Technical Working Group Co-Chair: Tony Rosati, TrustPoint Innovation
Security Technical Working Group Co-Chair: Erik Wood, Cypress Semiconductor
Analog Working Group Co-Chair: Mohammed Ratni, Sony
Analog Working Group Co-Chair: Andreas Woerle, Infineon
Digital Working Group Chair: Dr. Michael Stark, NXP
NFC Devices Technical Working Group Chair: Klaus Roehrle, Sony
Compliance Committee Chair: Henk Dannenberg, NXP
Henk Dannenberg is RFID Standards Architect for the Business Unit Secure Identification Solutions of NXP Semiconductors. He is located in the Netherlands, from where he defines and executes the standardization strategy for the product line Smart Mobility & Retail. Henk represents NXP Semiconductors in several international standardization bodies, such as ISO/IEC JTC1/SC31, GS1, CEN, ETSI and NEN and has been an active contributor to the latest Gen2V2 RFID standards.
Henk joined NXP Semiconductors (at that time called Philips Semiconductors) in North America in 2000, after working 10 years for the TIRIS division of Texas Instruments in the Netherlands and Dallas, TX, bringing over 25 years of experience in the RFID industry.
Compliance Committee Vice-Chair: Matt Ronning, Sony
Matt Ronning is Director of Engineering for Sony’s Component Solutions Business Division located in San Diego, California. In this position, Matt and his engineering team support both module and integrated circuit development for the consumer and automotive markets. As a communications systems engineer, Matt has over 20 years experience in the development of IC’s and modules supporting Cellular, Digital TV, GPS, and wireless/wireline PAN/LAN technologies, and has been an active contributor to a number of specification organizations such as IEEE and SAE.
Minimum Level of Interoperability Working Group Chair: Michael Stark, NXP
Compliance Program Working Group Chair: Stanley Cho, FIME
Testing Working Group Chair: Diego Lébron, AT4 Wireless