Bios of Chairs

SIG Committee

SIG Committee Chair: Koichi Tagawa, DNP

Coming soon.

Internet of Things Working Group Chair: Vincent Chauvin, Apple

Coming soon.

Retail & Payment Working Group Chair: Matthew Bright, Thin Film Electronics

Matthew Bright is the head of technical marketing at the Thin Film Electronics NFC Innovation Center in San Jose, California. Following a vision of ‘building intelligence into everyday things’, he leads customer and partner engagement for a new generation of NFC tags and RF anti-shoplifting labels based on highly scalable printed electronics technology. Matthew holds a degree in electrical engineering from the University of Michigan and has extensive experience in semiconductor marketing for mobile applications, including Flash memory, multi-chip modules, and short-range wireless communications.

Mobility Identity, and Transport Working Group Co-Chair: Cord Bartels, BSI

Coming soon.


Technical Committee

Technical Committee Chair: Jürgen Böhler, STMicroelectronics

Jürgen works as Software System Architect for Telecommunication and NFC chips within the Smartcard Division of STMicroelectronics. Since 1995 he has experience in designing and implementing different Smartcard operating systems. Therefore Jürgen participates since 1998 in different standardization bodies and influenced several international specifications. In 2002 he started his work in the NFC ecosystems. Since 2007 he follows up the technical groups of the NFC Forum.

Analog Working Group Co-Chair: Mohammed Ratni, Sony

Coming soon.

Analog Working Group Co-Chair: Andreas Woerle, Infineon

Coming soon.

Digital Working Group Chair: Dr. Michael Stark, NXP

Coming soon.

NFC Devices Technical Working Group Chair: Klaus Roehrle, Sony

Coming soon.

Reference Applications Framework Working Group Chair: Daniel Orsatti, STMicroelectronics

Coming soon.

Security Working Group Chair: Markus Moesenbacher, Infineon

Coming soon.


Compliance Committee

Compliance Committee Chair: Henk Dannenberg, NXP

Henk Dannenberg is RFID Standards Architect for the Business Unit Secure Identification Solutions of NXP Semiconductors. He is located in the Netherlands, from where he defines and executes the standardization strategy for the product line Smart Mobility & Retail. Henk represents NXP Semiconductors in several international standardization bodies, such as ISO/IEC JTC1/SC31, GS1, CEN, ETSI and NEN and has been an active contributor to the latest Gen2V2 RFID standards.
Henk joined NXP Semiconductors (at that time called Philips Semiconductors) in North America in 2000, after working 10 years for the TIRIS division of Texas Instruments in the Netherlands and Dallas, TX, bringing over 25 years of experience in the RFID industry.

Requirements and Policy Working Group Chair: Michael Stark, NXP

Coming soon.

Testing Working Group Chair: Diego Lébron, DEKRA

Coming soon.