Officers & Board of Directors
The Forum is led by a slate of officers comprised of representatives of the Forum’s Sponsor Members and elected by the board of directors. The board governs the direction of the Forum and is chartered with helping the organization’s officers fulfill its mission and with seeing that the Forum operates in the best interests of its members and according to its By-laws.
Pictured here is Chairman Koichi Tagawa.
Chairman Koichi Tagawa, DNP
Koichi Tagawa, Chairman, NFC Forum, has been with the organization since its founding in 2004. Initially serving as the Vice Chairman, Mr. Tagawa was elected as Chairman in 2008. During his leadership tenure, he has been an advocate for NFC market expansion, and has overseen the development of over 20 standards-based specifications which are the foundation for interoperable NFC-based solutions worldwide. Mr. Tagawa is the General Manager of Global Standards and Industry Relations at the C&I Center in Dai Nippon Printing Co., Ltd. (DNP). DNP is the largest printing company, and the largest NFC solution provider, in Japan. Prior to DNP, Tagawa worked in the consumer electronics industry at Sony for 41 years. He now is devoted to promoting the expansion of NFC solution businesses worldwide by fusing his consumer-oriented background with his passion for NFC technology.
Secretary Frank Dawidowsky, Sony
Treasurer Laurent Sourgen, STMicroelectronics
Board of Directors
The Board of Directors consists of one representative from each Sponsor Member.
Dawei Zhang, Apple Inc.
Masao Yamada, Dai Nippon Printing
Chris Oryschak, Google
Bjoern Sharfen, Infineon Technologies AG.
Bjoern has more than 20 years of experience in the electronic components industry and is currently holding the position of Senior Director, heading the Product Line Payment and Wearables at Infineon Technologies. He assumes worldwide responsibility for the P&L of security controllers and
solutions used in Payment & Wearables applications.
Prior to this role he worked for over 15 years in various positions within the Marketing team of the Security & Chip Card ICs division for Payment. Transport and Communication.
Before joining Infineon in 2000, he started his professional career in 1997 with the Ceramic Components Division at Epcos AG as Product Marketing Engineer for automotive, industrial and consumer applications.
He holds a degree (Dipl. Wirt.-Ing.) in Industrial Engineering and Management from the Munich university of applied Science
Eddy Van de Velde, Mastercard
Fabrice Punch, NXP Semiconductors
Fabrice Punch is Marketing Director at NXP Semiconductors, currently leading the NFC segment for IoT and Smart Home, and is based in Caen, France. He has more than 15 years’ experience in B2B Marketing and Business Development of semiconductors solutions in high-tech industries worldwide. Fabrice joined the NFC Forum activities in 2018 and is fully dedicated to make our life more personal, convenient and exciting by adding NFC functionality to everyday devices. He holds a degree Master of Science in Engineering from Grenoble INP.
Neeraj Bhatia, Qualcomm
Jack Lee, Samsung Electronics
Yo Tabayashi, Sony
Laurent Sourgen, STMicroelectronics
Giampaolo Marino, Thinfilm
Giampaolo Marino serves as Thinfilm’s Executive Vice President of Hardware Solutions. With nearly 20 years of product leadership and go-to-market experience in the areas of mobile, IoT, consumer, and industrial applications, he is responsible for overseeing product management, engineering, corporate quality, and ecosystem strategic partnerships. Prior to Thinfilm, Giampaolo held leadership positions at NXP Semiconductors, Monolithic Power Systems, Texas Instruments, Intersil, and Analog Devices. He holds an MBA degree from the Franklin W. Olin School of Business at Babson College and a Bachelor of Science degree in Electrical Engineering and Computer Science from San Jose State University.
Barbara Patterson, Visa Inc.
Barbara Patterson is a Vice President at VISA with extensive experience in developing groundbreaking payments and processing products. She is an expert in driving critical strategic initiatives, accelerating revenue growth, reducing costs, and creating competitive advantage. Having held a range of management roles at Visa, her experience includes providing business and technical direction for credit, debit, commercial, and prepaid solutions for the US and Global payments industry. Barbara has been leading various activities within digital payments solutions focused on tokenization and secure remote commerce. She leads the Digital Standards and Strategic Projects organization that oversees digital payment standards with a focus on new and emerging technologies, payment methods and security solutions.
A recognized Payment Industry and Visa expert, she is frequently called upon for understanding and designing creative solutions that solve complex business issues and address customer needs to drive competitive advantage for all aspects of the payment ecosystem.
Barbara has been granted a number of patents and has filed several more that are in review which support innovative development initiatives in the Payments Industry. She is an active participant in number of EMVCo working groups, including Tokenisation Working Group (TWG) and Secure Remote Commerce Working Group (SRCWG). Prior to joining Visa, held a number of positions at Wells Fargo Bank in San Francisco.